Probe card assembly with an interchangeable probe insert

ABSTRACT

A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The insert holder can be detached from the probe card assembly. The probe insert of the probe card assembly can be replaced by detaching the insert holder, replacing the probe insert with a new probe insert, and then reattaching the insert holder to the probe card assembly. The probe insert and holder can be integrally formed and comprise a single structure that can be detached from a probe card assembly and replaced with a different probe insert and holder.

BACKGROUND

FIG. 1A illustrates an exemplary prior art probing system used to test adevice under test (“DUT”) 112, which may be, for example, one or moredies (not shown) on a newly manufactured semiconductor wafer or otherelectronic devices (e.g., previously manufactured dies). The probingsystem of FIG. 1A can include a test head 104 and a prober 102 (which isshown with a cut-away 126 to provide a partial view of the inside of theprober 102). To test DUT 112, the DUT is placed on a moveable stage 106as shown in FIG. 1A, and the stage 106 is moved such that input and/oroutput terminals of the DUT 112 are brought into contact with probes 124of a probe card assembly 108, which as shown, is attached to a test headplate 121. For example, the probe card assembly 108 may be bolted orclamped to the test head plate 121 with the probe substrate 122 andprobes 124 extending into the prober 102 through opening 132 (see FIG.1B).

Typically, a cable 110 or other communication means connects a tester(not shown) with the test head 104. The tester (not shown) generatestest data to be written to the DUT 112, and the tester receives andevaluates response data generated by the DUT 112 in response to the testdata. The cable 110 can provide a plurality of communications channels(not shown) to and from the tester (not shown) for such test andresponse data. Typically, there can be a communications channel (notshown) for each input and/or output terminal of the DUT 112, and theremay be further communications channels for providing power and ground tothe DUT 112.

The test head 104 and test head connectors 114 provide electricalconnections that connect the tester channels (not shown) to the probecard assembly 108. The probe card assembly 108 shown in FIG. 1A caninclude a wiring board 120 and a probe substrate 122. The wiring board120 provides electrical connections (not shown) from connectors 114 to aprobe substrate 122, and the probe substrate provides electricalconnections to the probes 124. The probe card assembly 108 thus providesan interface that connects the tester communications channels (notshown) to the input and/or output terminals (not shown) of a DUT 112.

While terminals (not shown) of DUT 112 are pressed against probes 124(thus forming electrical connections between the terminals and theprobes), the tester (not shown) runs tests on the DUT 112. For example,the tester (not shown) may run functional tests on the DUT 112 in whichthe DUT can be operated in various modes. Monitoring results of suchoperation, the tester (not shown) determines whether the DUT 112functions properly. Such tests may also be used to determine a maximumreliable operating speed of the DUT 112. Parametric tests are anotherexample of tests that may be run on the DUT 112. Parametric tests mayinclude such things as measuring leakage current in the DUT 112,determining whether the DUT 112 has a short-circuit fault oropen-circuit fault, etc.

SUMMARY

In an exemplary embodiment of the invention, an insert holder can beconfigured to hold a probe insert, which can include probes disposed ina particular configuration for probing a device to be tested. The insertholder can be attached to and detached from a probe card assembly, whichprovides an electrical interface to a tester that controls testing ofthe device. While attached to the probe card assembly, the insert holdercan hold the probe insert such that the probe insert is electricallyconnected to electrical paths within the probe card assembly that arepart of the interface to the tester. While detached from the probe cardassembly, the insert holder can allow the probe insert to be removed andreplaced with a new probe insert, which may be configured differentlythan the first probe insert. In some embodiments, the probe insert andprobe holder can be integrally formed and comprise a single structure.

DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B illustrate an exemplary prior art probing system fortesting dies of a semiconductor wafer.

FIG. 2 shows an exploded, perspective view of an exemplary probe cardassembly according to some embodiments of the invention.

FIG. 3A shows a top view of the probe card assembly of FIG. 2 withoutthe cover.

FIG. 3B shows a bottom view of the probe card assembly of FIG. 2.

FIG. 3C shows a side, cross-sectional view of the probe card assembly ofFIG. 2 without the cover.

FIG. 4 illustrates exemplary adjustment of a planarity or orientation ofthe probes of the probe card assembly of FIG. 2.

FIG. 5 shows an exploded, perspective view of the probe head assembly ofFIG. 2.

FIG. 6A shows a top view of the probe head assembly of FIG. 5.

FIG. 6B shows a bottom view of the probe head assembly of FIG. 5.

FIGS. 6C and 6D show side, cross-sectional views of the probe headassembly of FIG. 5.

FIG. 7 shows an exploded, perspective view of an attachment tool with acover but without an insert holder according to some embodiments of theinvention.

FIG. 8A shows a top view of the attachment tool of FIG. 7 with an insertholder but without the cover.

FIG. 8B shows a bottom view of the attachment tool of FIGS. 8A and 8B.

FIGS. 8C and 8D show side, cross-sectional views of the attachment toolof FIG. 8A.

FIGS. 9A, 9B, and 9C illustrate exemplary changing of an insertaccording to some embodiments of the invention.

FIG. 10 illustrates an exemplary DUT in the form of a semiconductor die.

FIG. 11 illustrates in schematic format an exemplary configuration ofthe probe card assembly of FIG. 2 for testing the DUT of FIG. 10according to some embodiments of the invention.

FIG. 12A illustrates a top view of a probe insert configured for testingthe DUT of FIG. 10 according to some embodiments of the invention.

FIG. 12B illustrates a bottom view of the probe insert of FIG. 12A.

FIG. 13 illustrates another exemplary DUT in the form of a semiconductordie.

FIG. 14A illustrates a top view of a probe insert configured for testingthe DUT of FIG. 13 according to some embodiments of the invention.

FIG. 14B illustrates a bottom view of the probe insert of FIG. 14A.

FIG. 15 illustrates in schematic format an exemplary reconfiguration ofthe probe card assembly of FIG. 2 for testing the DUT of FIG. 13according to some embodiments of the invention.

FIG. 16A illustrates a top view of another exemplary probe card assemblyaccording to some embodiments of the invention.

FIG. 16B illustrates a side, cross-sectional view of the probe cardassembly of FIG. 16A.

FIG. 17A illustrates a top view of yet another exemplary probe cardassembly according to some embodiments of the invention.

FIG. 17B illustrates a side, cross-sectional view of the probe cardassembly of FIG. 17A.

FIG. 18 illustrates a side, cross-sectional view of still anotherexemplary probe card assembly according to some embodiments of theinvention.

FIG. 19 illustrates a side, cross-sectional view of another exemplaryprobe card assembly according to some embodiments of the invention.

FIG. 20 illustrates a side, cross-sectional view of still anotherexemplary probe card assembly according to some embodiments of theinvention.

FIGS. 21-24 illustrate exemplary shielded signal traces according tosome embodiments of the invention.

FIG. 25 illustrate an exemplary shielded wire according to someembodiments of the invention.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

This specification describes exemplary embodiments and applications ofthe invention. The invention, however, is not limited to these exemplaryembodiments and applications or to the manner in which the exemplaryembodiments and applications operate or are described herein.

FIGS. 2 and 3A-3C illustrate an exemplary probe card assembly 200 thatmay be used in a prober or other system for testing electronic devicesaccording to some embodiments of the invention. For example, probe cardassembly 200 may be used in place of probe card 108 in a test systemthat can include a prober like prober 102 of FIGS. 1A and 1B. For easeof discussion, probe card assembly 200 will be discussed herein as usedin prober 102. Probe card assembly 200 may, however, be used in anyprober for probing semiconductor wafers or singulated dies or any othersystem for probing a device to test, monitor, or otherwise operate thedevice.

FIG. 2 shows an exploded, perspective view of the probe card assembly200, and FIG. 3A shows a top view, FIG. 3B shows a bottom view, and FIG.3C shows a side cross-sectional view of probe card assembly 200.

As shown, the probe card assembly 200 can include a wiring substrate202, a stiffener plate 204, and an adjustment plate 206 to which a probehead assembly 209 can be attached. The probe card assembly 200 may alsoinclude a cover 282, which is shown in FIG. 2 but, for purposes ofclarity and ease of illustration, is not shown in FIGS. 3A-3C. As shownin FIG. 2, the cover 282 can be fastened to the wiring substrate 202with screws 240 that pass through holes 272 in cover 282 and thread intospacers 242 and with screws 246 that pass through holes 280 in thewiring substrate 202 and also thread into spacers 242.

As will be seen, one function of the probe card assembly 200 can be toprovide an electrical interface between communications channels to andfrom the tester and the input and/or output terminals (not shown) of aDUT such as 112 in FIG. 1A. (As used herein, the term “DUT” can be oneor more dies of an unsingulated semiconductor wafer, one or moresemiconductor dies singulated from a wafer (packaged or unpackaged), oneor more dies of an array of singulated semiconductor dies disposed in acarrier or other holding device, one or more multi-die electronicsmodules, one or more printed circuit boards, and/or any other type ofelectronic device or devices.) As discussed above, the tester (notshown) can be configured to generate test data to be written to the DUT112 and to receive and evaluate response data generated by the DUT 112in response to the test data. Wiring substrate 202 can include channelconnectors 208 for making electrical connections with the communicationschannels to and from the tester (not shown). For example, channelconnectors 208 may be configured to make electrical connections with thetest head 104 of FIGS. 1A and 1B, which in turn can be connected to atester (not shown) through cable 110. As discussed above, the cable 110and test head 104 provide communications channels (not shown) to andfrom the tester (not shown) for test data, response data, power, ground,and/or other electrical signals.

The channel connectors 208 shown in FIGS. 2, 3A and 3C may bezero-insertion-force (“ZIF”) connectors that include multiple pin-typeconnectors (not shown) such that each channel connector 208 connectselectrically to multiple tester channels. In the example shown in FIGS.2 and 3A-3C, each channel connector 208 can be connected to four testerchannels (not shown), and each of those four electrical connections canbe in turn connected to one of four electrically conductive traces 210.(In other examples, more or fewer than four tester channels can beconnected to more or fewer than four traces 210.) As shown in FIGS. 3Aand 3C, electrically conductive wires 398 provide electrical connectionsfrom the traces 210 to conductive pins 220, which as will be seen, canbe electrically connected to probes 236. (Only two wires 398 are shownin FIGS. 3A and 3C for simplicity and ease of illustration. Depending onthe application, a sufficient number of wires 398 would typically beused to electrically connect most or all of the traces 210 to most orall of the pins 220.) Opening 216 in the adjustment plate 206 providesaccess to pins 220.

The use of ZIF connectors 208 is optional, and indeed, any typestructure for making electrical connections may be used. For example,channel connectors 208 may be conductive pads or terminals configured toengage electrically conductive pogo pins from the test head 104.

The composition of the wiring substrate 202 is not important and anysubstrate material may be used. For example, the wiring substrate 202may be a printed circuit board. In another example, the wiring substrate202 may comprise a ceramic material, which may provide greater strengthand resistance to bending or warping than one or more printed circuitboard materials. The wiring substrate 202 may be configured to attach toprober 102. For example, the wiring substrate 202 may be configured tobe bolted or clamped to the test head plate 121 of prober 102 (see FIGS.1A and 1B). As just one example, the wiring substrate 202 may includeholes (not shown) along its periphery that correspond to holes 134 ofthe test head plate 121. Those holes may receive bolts (not shown) thatbolt the wiring substrate 202 to the test head plate 121.

Turning now to the stiffener 204, the stiffener can be configured toprovide mechanical strength to the probe card assembly 200. For example,such mechanical strength may be utilized to resist bending, warping, orother movement (e.g., horizontal or radial expansion or contraction) ofthe wiring substrate 202 and/or other parts of the probe card assembly200 that may be caused by mechanical loads, thermal gradients, etc. Suchbending, warping, or other movement may move the probes 236 from theirintended positions, which may cause one or more of the probes to presswith too much force against the DUT 112, which may damage the probes 236and/or the DUT 112. Such unwanted movement of the probes 236 mayalternatively cause the probes 236 to press against the DUT with toolittle force to establish good electrical connections or to not contactthe DUT 112 at all. The stiffener 204 may be composed of any material ormaterials that are sturdy and/or provide the needed mechanical strengthfor a particular application of the probe card assembly 200. Forexample, the stiffener 204 may be a metal plate.

Thermal gradients across the probe card assembly 200, which may warp orbend the wiring substrate 202 or other parts of the probe card assembly200, may arise while a DUT 112 is tested at lowered or elevatedtemperatures. Typically, stage 106 cools or heats the DUT 112 duringtesting. Such cooling or heating of the DUT 112 can cause thermalgradients across the probe card assembly 200 in which the temperature onthe probe-side of the probe card assembly 200 is cooler or hotter thanthe temperature on the channel-connector (208) side of the probe cardassembly 200. The stiffener plate 204 as well as the use of a ceramicwiring substrate 202 are examples of techniques that may be used tocounteract the effects of such thermally induced bending or warping.

In the exemplary probe card assembly 200 shown in FIGS. 2 and 3A-3C, theexemplary stiffener 204 can be attached to the wiring substrate 202 andprovides mechanical strength directly to the wiring substrate 202.Alternatively, the stiffener 204—rather than the wiring substrate202—may be configured to be attached to the test head plate 121 ofprober 102, in which case the stiffener 204 may be attached directly tothe test head plate 121 using any of the means discussed above forattaching the wiring substrate 202 to the test head plate 121. Anexample of a stiffener 204 configured to be attached to a test headplate 121 of a prober 102 is disclosed and discussed in U.S. ProvisionalPatent Application 60/594,562, which was filed on Apr. 21, 2005 with adocket no. P226-PRV.

Turning now to the adjustment plate 206, in the probe card assembly 200shown in FIGS. 2 and 3A-3C, the wiring substrate 202 and/or stiffenerplate 204 as well as the probe head assembly 209 can be attached to theadjustment plate 206, which may be made of any sturdy material. Forexample, the adjustment plate 206 may be metal, ceramic, etc. If theadjustment plate 206 is made of metal or other materials that resistbending or warping, attaching the probe head assembly 209—and thus theprobes 236—directly to the adjustment plate helps keep the probes 236 inposition even if mechanical loads or thermal gradients cause bending orwarping of the wiring substrate 202 or other parts of the probe cardassembly 200, as discussed above. As will be discussed below, theadjustment plate 206 also can allow a planarity or orientation of theprobes 236 to be adjusted.

Turning now to the probe head assembly 209, a primary purpose of whichcan be to hold a probe insert 238 (which is not visible in FIGS. 2 and3A but is visible in FIGS. 3B and 3C) that has electrically conductiveprobes 236 for contacting and making electrical connections with inputand/or output terminals (not shown) of a DUT 112 (see FIG. 1A), which asdiscussed above, may be one or more dies of an unsingulatedsemiconductor wafer, one or more singulated dies (packaged orunpackaged), an electronics module, or any other electronics device orother device to be tested.

As shown in particular in FIGS. 2 and 3C, the probe head assembly 209can be disposed within an opening 256 in the wiring substrate 202 and asimilar opening 254 in the stiffener 204 and attached to the adjustmentplate 206 by bolts 232 and nuts 290. As shown, bolts 232 extend from thetop of the probe head assembly 209, pass through holes 298 in theadjustment plate 206, and thread into nuts 290. In the exemplaryembodiment shown in FIGS. 2 and 3A-3C, the probe head assembly 209 canbe attached directly to the adjustment plate 206 rather than thestiffener 204 or wiring substrate 202. As discussed above, attaching theprobe head assembly 209 directly to the adjustment plate 206 may providegreater mechanical strength and stability to the probe head assembly 209than could be achieved if the probe head assembly 209 were attacheddirectly to the wiring substrate 202.

As also shown in particular in FIGS. 2, 3A, and 3C, jacking screws 276can thread into adjustment plate 206 and abut against stiffener 204.Thus, rotating a jacking screw 276 in one direction can cause jackingscrew 276 to advance toward stiffener 204 and push stiffener 204 awayfrom adjustment plate 206. Rotating jacking screw 276 in the oppositedirection can retract jacking screw 276 away from stiffener 204,allowing stiffener 206 to move toward adjustment plate 206.

Locking screws 214 pass through holes 274 in adjustment plate 206 andthread into stiffener 204. While locking screws 214 are sufficientlyloosened, jacking screws 214 may be advanced toward stiffener 204 orretracted away from stiffener 204 as discussed above. Tightening lockingscrews 214—that is, threading locking screws 214 into stiffener204—however, pulls stiffener 204 as close to adjustment plate 206 asjacking screws 276 allow and holds stiffener 204 in that position withrespect to adjustment plate 206.

Jacking screws 276 and locking screws 214 thus provide the ability toadjust the planarity or orientation of the adjustment plate 206 withrespect to the wiring substrate 204. Holes 248 in cover 282 (See FIG. 2)provide access to the jacking screws 276 and locking screws 214.Although four pairs of jacking screws 276 and locking screws 214 areshown in the probe card assembly 200 (see FIGS. 2 and 3A), fewer or morejacking screws 276 and locking screws 214 may be used.

As shown in FIG. 4 (which shows a simplified block diagram of probe cardassembly 200 attached to prober head plate 121 of the prober 102 ofFIGS. 1A and 1B), because the probe insert (which is not separatelyshown in FIG. 4 but, as discussed above, can be part of the probe headassembly 209) with probes 236 is attached to the adjustment plate 206,adjusting the planarity or orientation of the adjustment plate 206(e.g., from orientation 290 to 290′ in FIG. 4) also adjusts theplanarity or orientation of the probes 236 (e.g., from orientation 292to 292′ in FIG. 4) with respect to the test head plate 121 of prober102. Accordingly, the planarity or orientation of the probes 236 may beadjusted to correspond to the planarity or orientation of the DUT (e.g.,DUT 112 disposed on stage 106 in FIG. 1A).

FIGS. 5 and 6A-6D show details of an exemplary implementation of theprobe head assembly 209 according to some embodiments of the invention.(The depiction shown in FIGS. 5 and 6A-6D may not necessarily be toscale.) FIG. 5 shows an exploded, perspective view, FIG. 6A shows a topview, FIG. 6B shows a bottom view, and FIGS. 6C and 6D show side,cross-sectional views of probe head assembly 209. As shown in thoseFigures, the probe head assembly 209 can include an insert holder 230that holds a probe insert 238 with probes 236 for contacting the inputand/or output terminals (including power and ground terminals) of theDUT 112, a pin holder 218, and a spacer 252.

The insert holder 230 can include a graduated opening 234 with ledges306. The probe insert 238 can fit into a top of opening 234 and rest onledges 306, and the probes 236 attached to the insert 238 can extendthrough a bottom of opening 234, as shown most clearly in FIGS. 6C and6D. Insert holder 230 can also include recesses 237, which as shown inFIGS. 6B and 6C, provide access to set screws 239. As shown in FIG. 6C,set screws 239 thread through the insert holder 230 into the opening 234and against the probe insert 238. Rotating set screws 239 in onedirection tightens screws 239 against probe insert 238, which holdsprobe insert 238 in place within insert holder 230. Rotating screws 239in the other direction loosens screws 239, allowing probe insert 238 tobe removed from insert holder 230. Additional openings (not shown) maybe included around the periphery of opening 234 to facilitate removal ofa probe insert 238 from opening 234. Insert holder 230 may be formed ofany suitable material, including without limitation metal, ceramic, etc.

Probe insert 238 can include probes 236 attached to one side. Insert 238can also include electrically conductive pads 602 disposed on theopposite side from the probes 236. Electrical connections (not shown)connect ones of the pads 602 with ones of the probes 236. The insert 238may comprise any suitable material, including without limitationceramic, printed circuit board material, etc.

Probes 236 may be resilient, conductive structures. Nonlimiting examplesof suitable probes 236 include composite structures formed of a corewire bonded to a conductive terminal (not shown) on probe insert 238that can be over coated with a resilient material as described in U.S.Pat. No. 5,476,211, U.S. Pat. No. 5,917,707, and U.S. Pat. No.6,336,269. Probes 236 may alternatively be lithographically formedstructures, such as the spring elements disclosed in U.S. Pat. No.5,994,152, U.S. Pat. No. 6,033,935, U.S. Pat. No. 6,255,126, U.S. PatentApplication Publication No. 2001/0044225, and U.S. Patent ApplicationPublication No. 2001/0012739. Other nonlimiting examples of probes 236include conductive pogo pins, bumps, studs, stamped springs, needles,buckling beams, etc.

Pin holder 218 provides through holes 222 for a plurality ofelectrically conductive pins 220. The pins 220 pass through holes 222and make electrical connections with pads 602 on probe insert 238. Pins220 may be spring loaded to provide spring forces against the pads 602and thereby maintain electrical connections with the pads 602. Forexample, pins 220 may be pogo pins configured with a spring bias awayfrom the pin holder 218 and toward the probe insert 238. Pin holder 218may comprise any suitable material, including without limitation metal,ceramic, printed circuit board material, etc. If pin holder 218comprises an electrically conductive material, holes 222 can include anelectrically insulating material.

Spacer 252 can include an opening 216 into which pins 220 extend. Spacer252 may comprise any suitable material, including without limitationmetal, ceramic, printed circuit board material, etc.

As shown in FIG. 6D, bolts 232 extend through holes 402 and 502 in thepin holder 218 and spacer 252, respectively, and out of the top of theprobe head assembly 209. As shown in FIG. 3C, the portions of bolts 232that extend out of the top of the probe head assembly 209 pass throughholes 298 in the adjustment plate and thread into corresponding nuts290, thus attaching the pin holder 218 and spacer 252 to the adjustmentplate 206. Referring again to FIG. 6C, bolts 470 pass through holes 302in the insert holder 230 and thread into the pin holder 218, thusattaching the insert holder 230 to the pin holder 218 and thus also tothe spacer 252 and adjustment plate 206. As also shown, counter-sinkholes 460 in pin holder 218 accommodate the heads of bolts 232, allowinginsert holder 230 to be attached flush against the pin holder 218.

The insert 238 of probe card assembly 200 can be removed from probe cardassembly 200 by simply removing bolts 470, the removal of which detachesthe insert holder 230 from the pin holder 218 and thus from the probecard assembly 200. Once the insert holder 230 is removed, the probeinsert 238 may be removed from the insert holder 230 and replaced with anew insert 238′. Thereafter, the insert holder 230 can be reattached tothe probe card assembly 200 by passing bolts 470 through holes 302 inthe insert holder 230 and threading bolts 470 into the pin holder 218.Alternatively, a new insert holder 230′ with a new insert 238′ may beattached to pin holder 218 using bolts 470.

Other attachment mechanisms may be used in place of bolts 470. Forexample, screws, clamps, mechanical locking devices, etc. may be used inplace of bolts 470 to secure the insert holder 230 to the pin holder218. Moreover, insert holder 230 and probe insert 238 need not beseparate and distinct structural entities. For example, insert holder230 may be solid and thus lack opening 234. Terminals 602 may bedisposed on one side of insert holder 230 and probes 236 disposed on theother side with electrical connections between terminals 602 and probes236 through insert holder 230. In such a case, probe sets can be changedby changing insert holders 230 rather than changing probe inserts.

FIGS. 7 and 8A-8D illustrate an exemplary attachment tool 902 thatfacilitates attaching and detaching insert holder 230 to and from theprobe card assembly 200 according to some embodiments of the invention.FIG. 7 shows an exploded, perspective view of the attachment tool 902with an optional cover 904, and FIG. 8A shows a top view, FIG. 8B showsa bottom view, and FIGS. 8C and 8D show side, cross-sectional views ofthe attachment tool 902 (without the cover 904).

As shown, the attachment tool 902 can comprise a substrate 906 that hasa well 908. As shown in FIGS. 8A-8D, the well 908 can be sized toreceive an insert holder, like insert holder 230. As best seen in FIGS.7 and 8C, set screws 916 thread into threaded holes 914 in the substrate906 and into threaded holes 480 in the insert holder 230. Advancing setscrews 916 through hole 914 and into hole 480 holds the insert holder230 securely in well 908. Loosening set screws 916 such that the screws916 retract from holes 480, releases the insert holder 230, allowing theinsert holder 230 to be removed from well 908. The well 908 can includeextension 1004 that provides space 1006 for the probes 236 attached tothe insert 238. Holes 912 in the substrate 906 align with holes 302 inthe insert holder 230 and provide openings for a screw driver (notshown) or other tool for accessing screws 470, which as discussed above,attach the insert holder 230 to the pin holder 218. Removable cover 904may be screwed (not shown), bolted (not shown), clamped (not shown), orotherwise removably attached to the substrate 906.

FIGS. 9A, 9B, and 9C illustrate an exemplary process for changing insert238 on probe card assembly 200, which is shown in simplified blockformat. As shown in FIG. 9A, adjustment plate 206, stiffener 204, wiringsubstrate 202, and probe head assembly 209, although depicted in blockformat, can be as discussed above and can be assembled as discussedabove. As also discussed above, screws 470 attach the insert holder 230to the pin holder 218 (which can be attached to the spacer 252 (notshown in FIG. 9A) and the adjustment plate 206 by bolts 232 and nuts 290(not shown in FIG. 9A) as discussed above. Although not shown in FIG.9A, an insert 238 can be disposed in insert holder 230 as generallydiscussed above.

As shown in FIG. 9B, insert holder 230 may be removed from pin holder218 by moving 1102 attachment tool 902 (which is also shown insimplified block format in FIG. 9B but can include the featuresdescribed above with respect to FIGS. 7 and 8A-8D) such that the insertholder 230 can be disposed in the well 908 of the attachment tool 902.Set screws 916 can then be tightened as discussed above to secure theinsert holder 230 in the well 908. A tool such as a screw driver (notshown) can then be inserted through holes 912 in attachment tool 902 toengage screws 470, which can then be loosened and removed, whichdetaches the insert holder 230 from pin holder 218. The attachment tool902, now with insert holder 230 in its well 908, can be moved 1104 awayfrom the probe card assembly 200. Cover 904 may then be placed on theattachment tool 902 to protect the probe insert 238, and the probeinsert 238 may thus be safely stored or transported to a repairfacility.

As shown in FIG. 9C, a replacement insert holder 230′ that holds areplacement insert 238′ (not shown) may be attached to the probe cardassembly 200 in similar fashion. That is, another attachment tool 902′in whose well 908′ is secured the replacement insert holder 230′, can bemoved 1102′ into engagement with the pin holder 218 and holes 302 (notshown in FIG. 9C) in the insert holder 230′ can be aligned withcorresponding threaded holes (not shown) in the pin holder 218. A toolsuch as a screw driver (not shown) can then be inserted through holes912′ in attachment tool 902′ to drive screws 470 through holes 302 inthe new insert holder 230′ and thread screws 470 into the pin holder 218(as shown in FIG. 6C), attaching the new insert holder 230′ to the pinholder 218. Once screws 470 are tightened, set screws 916 can beloosened, releasing the insert holder 230′, and the attachment tool 902′can be moved 1104′ away from the insert holder 230′, which can now beattached to the pin holder 218.

As discussed above inert holder 230 and probe insert 238 may be modifiedto comprise a single entity rather than being separate structuralentities.

FIGS. 10, 11, 12A, 12B, 13, 14A, 14B, and 15 illustrate exemplaryapplication of the foregoing process of changing the probe insert 238 ofprobe card assembly 200 according to some embodiments of the invention.FIG. 10 illustrates a semiconductor die 1050, which can be an exemplaryDUT to be tested using probe card assembly 200. (Other examples of a DUTinclude, without limitation, a packaged die, a test structure or otherfeature on a semiconductor wafer, etc.) As shown, die 1050 can includeeight input and/or output terminals 1052 for receiving input signals,power, and ground into the die 1050, and for outputting signals from thedie 1050. As also shown, the terminals 1052 can be arranged on the die1050 in two rows with four terminals 1052 in each row.

FIG. 11 illustrates in simplified schematic format, a configuration ofprobe card assembly 200 for testing die 1050, and FIGS. 12A and 12Billustrate a probe insert 1138 for testing die 1050.

In FIG. 11, four channel connectors 208 of probe card assembly 200 canbe connected to eight tester channels 1150, which as discussed above,can be for providing test data, power, and ground from the tester (notshown) to die 1050 and providing response data generated by the die 1050in response to the test data to the tester (not shown). As alsodiscussed above, connections to the tester channels 1050 can be providedthrough the connectors 208 to traces 210, and wires 398 electricallyconnect traces 210 to conductive pins 220.

Probe insert 1138, like probe insert 238, can be designed to be placedin insert holder 230 and, while insert holder 230 is bolted 470 to pinholder 218, pads 1162 are pressed against and make electricalconnections with pins 220 as discussed above with respect to FIG. 2.(FIG. 12A shows a top view of insert 1138, and pads 1162 may begenerally similar to pads 602 of FIG. 5.) The pads 1162 can beelectrically connected to probes 1136, which as shown in FIG. 12B (whichshows a bottom view of insert 1138) can be arranged in a layout thatcorresponds to the terminals 1052 of die 1050. That is, probes 1136 canbe positioned and configured to correspond to and contact terminals 1052of die 1050. Thus, configured, probe card assembly 200 can be configuredto provide an electrical interface between tester channels 1150 and theterminals 1052 of die 1050. That is, connectors 208, traces 210, wires398, pins 220, pads 1162, and probes 1136 provide electrical pathsbetween tester channels 1150 and die 1050 pads 1052. Of course, wires398 associate corresponding traces 210 and pins 220 so that a testerchannel 1150 to which a particular signal is assigned can be connectedto the terminal 1052 of die 1050 that corresponds to that signal. Forexample, the channel 1150 that delivers power must be connected to aprobe 236 that is positioned to contact the power terminal 1052 of die1050. As another example, the channel 1150 that delivers a particularcontrol signal (e.g., a write enable signal) must be connected to aprobe 236 that contacts the terminal 1052 of die 1050 that is designedto receive that control signal (e.g., the write enable terminal 1052 ofdie 1050).

FIG. 13 illustrates another die 1060 that is to be tested and thusrepresents a second DUT with a second pattern of terminals to becontacted. As shown in FIG. 13, die 1060 can include six input and/oroutput terminals 1062 arranged in a single row. FIG. 14B shows a bottomview of a probe insert 1064 having six probes 1066 arranged in a singlerow to correspond to and contact pads 1062 of die 1060. The top side ofinsert 1064, which is shown in FIG. 14A, can be configured the same asinsert 1138. That is, insert 1064 can include eight pads 1168 arrangedso that, while insert 1064 is in insert holder 230 and insert holder 230can be attached by bolts 470 to pin holder 218, pads 1168 are pressedagainst and make electrical connections with pins 220. Because insert1064 can include only six probes 1066, only six of the eight pads 1168are connected to probes 1066 and the other two pads 1168 are not used.

The probe card assembly 200, configured as discussed above with respectto FIGS. 11, 12A, and 12B to contact die 1050 may be easily reconfiguredto contact die 1060 by simply replacing insert 1138 with insert 1064 asdiscussed above with respect to 9A-9C. To the extended necessary, wiring398 may also be reconfigured. For example, as shown in FIG. 15, becausedie 1060 has only six terminals 1062, only six of the eight testerchannels 1150 are needed to test die 1060. Wires 398 may thus bereconfigured to connect only six tester channels 1150 to only six pins220 that correspond to the six pads 1162 on insert 1064 that areconnected to the six probes 1066 of insert 1064. As discussed above, thewires 398 connect tester channels 1050 with probes 236 to match channel1050 signals with terminal 1062 signals.

It should be apparent that most of the probe card assembly 200 can beused to test both die 1050 and die 1060 despite that fact that theconfiguration, layout, position, and signal assignments of the terminals1052 of die 1050 are different than for the terminals 1062 of die 1060.Indeed, the wiring substrate 202, stiffener 204, adjustment plate 206,cover 282, and all of the probe head assembly except the probe insert238 may be used to test both dies 1050, 1060. Only the probe insert 238and the wires 398 need be changed. Of course, the ability to reuse mostof the probe card assembly 200 in testing dies of differentconfigurations may provide cost and time savings as compared toredesigning and manufacturing a completely new probe card assembly foreach new die configuration to be tested.

The examples shown in FIGS. 10-14B are exemplary only. Many variationsare possible. For example, the number and layout of terminals on a dieand the number and layout of tester channels is exemplary only andprovided for purposes of example and ease of discussion. Moreover, thedepictions in FIGS. 10-14B may not be to scale.

The ease with which a probe insert 238 may be changed in probe cardassembly 200 also facilitates repair of the probe card assembly 200.Failure of one or more probes 236 can be a problem that gives rise tothe need to repair a probe card assembly. If a probe 236 of probe cardassembly 200 fails (e.g., breaks), the probe insert 238 may be removedand replaced with a new probe insert 238. The removed probe insert 238with the broken probe 236 may then be taken to a repair facility wherethe probe is fixed or replaced. In the mean time, however, the probecard assembly 200—now with the new probe insert 238—may continue to beused to test DUTs. There is no need to transport the entire probe cardassembly 200 to the repair facility and thus take the probe cardassembly 200 out of use during the time required to repair the probe236.

FIGS. 16A, 16B, 17A, 17B, and 18-20 illustrate other exemplary probecard assemblies having probe inserts that can be removed and replacedaccording to some embodiments of the invention.

FIGS. 16A and 16B illustrate another exemplary probe card assembly 1200according to some embodiments of the invention. FIG. 16A illustrates atop view with a cutout 1290 in cover 1250. Cutout 1290 reveals pads1254. FIG. 16B illustrates a side-cross-sectional view of probe cardassembly 1200.

As shown, probe card assembly 1200 can include a wiring substrate 1202with channel connectors 1208 and an insert 1238 with probes 1236, all ofwhich may be generally similar to like named elements of probe cardassembly 200. In the probe card assembly 1200, electrically conductivetraces 1210, which pass through passages 1270 in cover 1250 as shown inFIG. 16B, provide electrical connections for data signals, controlsignals, and other input and/or output (e.g., power and ground) from thechannel connectors 1208 to electrically conductive pads 1254 disposed onan upper surface of the wiring substrate 1202. Electrically conductivevias 1260 electrically connect pads 1254 with pads 1256 disposed on alower surface of the wiring substrate 1202.

Insert 1238 can be disposed on ledges 1266 of an insert holder 1230.Bolt 1264 passes through holes (not shown) in insert holder 1230, wiringsubstrate 1202, and cover 1250 to engage nuts 1252. While the insertholder 1230 is bolted to the wiring substrate 1202 by bolts 1264 andnuts 1252 as shown in FIG. 16B, electrically conductive pads 1258 on theinsert 1238 are held against, and thus engage, pads 1256 and therebyform electrical connections with the pads 1256 on the lower surface ofthe wiring substrate 1202. The pads 1258 on the insert 1238 can beelectrically connected to the probes 1236 by electrically conductivevias 1262 as shown in FIG. 16B.

Insert 1238 can be replaced by loosening bolts 1264 and detaching theinsert holder 1230 from the wiring substrate 1202. Once the insertholder 1230 is detached from the wiring substrate 1202, the insert 1238may be removed from the insert holder 1230 and replaced with a newinsert 1238′. The insert holder 1230 may then be reattached to thewiring substrate 1202 with bolts 1264, connecting the new insert 1238′to the pads 1256 on the lower surface of the wiring substrate 1202 andthus also to channel connectors 1208.

FIGS. 17A and 17B show yet another exemplary probe card assembly 1300,which can be generally similar to probe card assembly 1200, and in fact,like numbered elements in probe card assembly 1200 and probe cardassembly 1300 are the same. In probe card assembly 1300, however,electrically conductive vias 1360 electrically connect the channelconnectors 1208 with electrically conductive traces 1310 disposed alongthe lower surface of the wiring substrate 1202. Traces 1310 pass throughpassages 1370 in the insert holder 1230 and connect to the conductivepads 1256 on the lower surface of the wiring board 1202.

FIG. 18 illustrates a side cross-sectional view of yet another exemplaryprobe card assembly 1400, which can be generally similar to probe cardassemblies 1200 and 1300 (like numbered elements are the same) exceptthat channel connectors 1208 are electrically connected to pads 1256 onthe lower surface of the wiring substrate 1202 by conductive paths 1410that comprise electrically conductive vias and traces embedded withinwiring substrate 1202.

FIG. 19 illustrates an additional exemplary probe card assembly 1500,which can include channel connectors 1208 and probes 1236 that are thesame as like number elements in probe card assemblies 1200, 1300, and1400. Although otherwise similar to wiring substrate 1202, wiringsubstrate 1502 of probe card assembly 1500 can include an opening 1514into which fits insert 1538. As shown in FIG. 19, insert 1538 fits intoopening 1514 in the wiring substrate 1502 such that probes 1536 extendout of the opening 1514. Electrically conductive pads 1558 disposed onshoulders 1520 of the insert 1538 rest on, and thereby make electricalconnections with, electrically conductive pads 1556 on the wiringsubstrate 1502. As also shown in FIG. 19, electrical paths 1510comprising conductive vias and traces disposed within wiring substrate1502 electrically connect channel connectors 1208 to pads 1556, andelectrical paths 1512 comprising conductive vias and traces disposedwithin the insert 1538 electrically connect pads 1558 with probes 1236.Brackets 1504, which can be bolted to the wiring substrate 1502 by bolts1264 and nuts 1252, hold the insert 1538 in place against the wiringsubstrate 1502.

Insert 1538 can be replaced by loosening bolts 1264 and removing insert1238. A new insert 1538′ may then be disposed within opening 1514 in thewiring substrate 1502, after which bolts 1264 can be tightened to holdthe new insert 1538′ in place.

FIG. 20 illustrates still another exemplary probe card assembly 1600,which can be generally similar to probe card assembly 1500 (likenumbered elements are the same). In probe card assembly 1600, however,electrically conductive vias 1604 electrically connect probes 1236 withelectrically conductive pads 1604 on insert 1638, and electricallyconductive wires 1602 electrically connect pads 1604 with channelconnectors 1208.

In FIGS. 16B, 17B, and 18, the electrical connection between pads 1256and 1258 may be formed by including resilient electrical connectors(e.g., pogo pins, conductive elastomers, conductive fuzz buttons,conductive springs, wires each bonded at one end to a pad and having acompliant deformity that the other end, compliant bellows contacts,etc.) (not shown) between pads 1256 and 1258. Similarly, in FIGS. 19 and20, the electrical connection between pad pairs 1558 and 1556 may bemade using resilient electrical connectors (e.g., pogo pins, conductiveelastomers, conductive fuzz buttons, conductive springs, etc.) (notshown).

FIG. 21 illustrates a shielded trace 1700 that may be used in place ofany of the electrically conductive traces and/or vias shown in any ofexemplary probe card assemblies 200, 1200, 1300, 1400, 1500, or 1600disclosed herein. As shown in FIG. 21, trace 1700 can include anelectrically conductive signal trace 1706 for carrying a data or controlsignal. Electrically conductive planes 1702, which may be connected toground, a guard potential, or a voltage source (not shown), electricallyshield the signal trace 1706. Insulating material 1704 electricallyinsulates the signal trace 1706 from the planes 1702. As an alternative,multiple signal traces 1706 may be disposed between plates 1702. As yetanother alternative, grounded or guard potential traces 2202, 2204 maybe disposed within insulating material 1704 on either side of signaltrace 1706 to further shield signal trace 1706 as shown in FIG. 22(which illustrates shielded trace 1700′).

FIGS. 23 and 24 illustrate other exemplary shielded traces 2300, 2400that may be used in place of any of the electrically conductive tracesand/or vias shown in any of exemplary probe card assemblies 200, 1200,1300, 1400, 1500, or 1600 disclosed herein. In FIG. 23, a signal trace2306 (which may be like signal trace 1706) can be embedded withininsulating material 2308, which in turn, can be surrounded by conductiveplate 2302 and conductive box structure 2310, shielding signal trace2306. Conductive box 2310, insulating material 2308, and signal trace2306 may be embedded in a substrate 2304, which may comprise a printedcircuit board. FIG. 24 shows a variation of trace 2300 of FIG. 23. InFIG. 24, signal trace 2306, which can be surrounded by insulatingmaterial 2308, can be shielded by a conductive box structure 2404 and aconductive covering structure 2402.

FIG. 25 illustrates a shielded wire 1800 that may be used in place ofany of the electrically conductive wires shown in any of exemplary probecard assemblies 200, 1200, 1300, 1400, 1500, or 1600 disclosed herein.As shown in FIG. 22, shielded wire 1800 can include an electricallyconductive signal line 1806 for carrying a data or control signal. Anelectrical conductor 1802, which may be connected to ground or a guardpotential, surrounds the signal line 1806 and thus electrically shieldsthe signal line 1806. Insulating material 1804 electrically insulatesthe signal line 1806 from conductor 1802. A protective jacket 1808protects the wire 1800. Shielded wire 1800 may be, for example, acoaxial cable.

By utilizing shielded traces 1700, 1700′, 2300, 2400 and/or shieldedwires 1800 in the embodiments of a probe card assembly 200, 1200, 1300,1400, and 1500, the operating frequency of those probe card assembliescan be increased. Thus, when such probe card assemblies are used to runfunctional tests on DUTs, the use of shielded traces 1700, 1700′, 2300,2400 and/or wires 1800 increases the maximum frequency at which thetests can be run. The use of shielded traces 1700, 1700′, 2300, 2400and/or shielded and/or guard potential wires 1800 also increasessensitivity to certain parametric tests, such as the detection ofleakage current in the DUT. Thus, for example, when such probe cardassemblies are used to run parametric tests on DUTs, the use of shieldtraces 1700, 1700′, 2300, 2400 and/or wires 1800 can allow for thedetection of very small leakage currents.

Although specific embodiments and applications of the invention havebeen described in this specification, there is no intention that theinvention be limited to these exemplary embodiments and applications orto the manner in which the exemplary embodiments and applicationsoperate or are described herein. For example, screws 470 of FIGS. 5 and6A-6D may be replaced with bolts (not shown) that extend through holesin the pin holder 218, spacer 252, and adjustment plate 206 to engagenuts (not shown). As another example, small additional wells (not shown)may be included around the periphery of the top of opening 234 in theinsert holder 230 to facilitate removing probe insert 238 from theopening 234. As still another example, the positions of bolts and nutsshown herein (e.g., bolts 1264 and nuts 1252) may be reversed. As stillfurther examples, the specific configurations of the embodiments shownherein may be modified by, for example, modifying elements of theembodiments, adding additional elements, or deleting elements. Forexample, the probe card assembly 200 of FIG. 2 may be configured withoutstiffener 204. Still further modifications include configuring probecard assembly 200 to allow multiple probe inserts (e.g., each like probeinsert 238) to be attached to the probe card assembly and providingmechanisms that allow the position, orientation, and/or location of eachsuch probe insert to be adjusted independently of the other probeinserts. A probe insert (e.g., like probe insert 238) can be configuredto contact more than one DUT or less than an entire DUT.

1. A probe card apparatus comprising: a first structure; a secondstructure comprising electrical contacts; a plurality of compliantelectrical connections to the electrical contacts; a mechanismconfigured to change an orientation of the second structure with respectto the first structure; and a third structure comprising a plurality ofprobes disposed to contact an electronic device to be tested, the thirdstructure configured to be attached to and detached from the secondstructure, wherein while attached to the second structure ones of theprobes are electrically connected to ones of the electrical contacts,wherein the third structure comprises: a probe insert comprising theprobes, and a holder attachable to and detachable from the secondstructure and configured to hold the probe insert.
 2. The probe cardapparatus of claim 1 further comprising an interface to a tester,wherein the compliant electrical connections electrically connect thetester interface to the electrical contacts.
 3. The probe card apparatusof claim 2, wherein the compliant electrical connections comprise wires.4. The probe card apparatus of claim 1, wherein while the holder isdetached from the second structure, the probe insert is removable fromthe holder.
 5. The probe card apparatus of claim 1 further comprising anattachment mechanism configured to attach the third structure to thesecond structure in a consistent and repeatable orientation.
 6. Theprobe card apparatus of claim 1 further comprising an attachmentmechanism configured to attach the third structure in a particularorientation to the second structure, detach the third structure from thesecond structure, and reattach the third structure in the particularorientation to the second structure.
 7. A probe card apparatuscomprising: a probe card assembly comprising a plurality of assembledelements that, while assembled, form an electrical interface to atester; and a probe structure comprising a plurality of probes disposedto contact an electronic device to be tested, wherein the probestructure is configured: to be attached to the probe card assembly,whereby ones of the probes are electrically connected to the testerinterface, and to be detached from the probe card assembly, whereby theones of the probes are electrically disconnected from the testerinterface, and wherein the probe structure comprises a first holder anda probe insert to which the probes are attached, and while the probestructure is detached from the probe card assembly, the probe insert isremovable from the first holder.
 8. The probe card apparatus of claim 7,wherein: the tester interface comprise first electrically conductivecontacts disposed on the probe card assembly, and while the first holderis attached to the probe card assembly, the first holder holds at leastone of second electrically conductive contacts on the probe insert inelectrical contact with at least one of the first contacts, wherein theat least one second contact is electrically connected to at least one ofthe probes.
 9. The probe card apparatus of claim 8 further comprising awiring substrate comprising channel connectors configured to makeelectrical connections with communications channels from the tester. 10.The probe card apparatus of claim 9 further comprising a second holderfor holding the first contacts, wherein at least one of the firstcontacts is electrically connected to at least one of the channelconnectors.
 11. The probe card apparatus of claim 10 further comprisingshielded electrical conductors, wherein at least one of the shieldedelectrical conductors connects the at least one first contact to the atleast one channel connector.
 12. The probe card apparatus of claim 10,wherein the first holder is attachable directly to the second holder.13. A probe card apparatus comprising: a first structure; a secondstructure comprising electrical contacts; a plurality of compliantelectrical connections to the electrical contacts; a mechanismconfigured to change an orientation of the second structure with respectto the first structure; a third structure attachable to and detachablefrom the second structure; and a probe insert insertable into a holderportion of the third structure, the probe insert comprising a pluralityof probes disposed to contact an electronic device to be tested, whereinwhile inserted into the third structure, the probes are electricallyconnected to ones of the electrical contacts.
 14. The probe cardapparatus of claim 13, wherein the compliant electrical connectionscomprise an electrical interface to a tester.
 15. The probe cardapparatus of claim 14, wherein the compliant electrical connectionscomprise wires.
 16. The probe card apparatus of claim 13, wherein whilethe third structure is detached from the second structure, the probeinsert is removable from the third structure.
 17. The probe cardapparatus of claim 13 further comprising an attachment mechanismconfigured to attach the third structure to the second structure in aconsistent and repeatable orientation.
 18. The probe card apparatus ofclaim 13 further comprising an attachment mechanism configured to attachthe third structure in a particular orientation to the second structure,detach the third structure from the second structure, and reattach thethird structure in the particular orientation to the second structure.